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? 2001-2013 microchip technology inc. preliminary ds21690b-page 1 mcp2155 features ? implements the irda ? standard including: -irlap -irlmp -ias -tinytp - ircomm (9-wire ?cooked? service class) ? provides irda standard physical signal layer support including: - bi-directional communication - crc implementation - data communication rates up to 115.2 kbaud ? includes uart to irda standard bit encoder/ decoder functionality: - easily interfaces to industry standard uarts and infrared transceivers ? uart interface for connecting to data communicating equipment (dce) systems ? transmit/receive formats (bit width) supported: -1.63s ? hardware baud rate selection for uart - 9.6 kbaud - 19.2 kbaud - 57.6 kbaud - 115.2 kbaud ? infrared baud rates supported - 9.6 kbaud - 19.2 kbaud - 38.4 kbaud - 57.6 kbaud - 115.2 kbaud ? 64 byte data packet size ? programmable device id string ? operates as secondary device cmos technology ? low-power, high-speed cmos technology ? fully static design ? low voltage operation ? industrial temperature range ? low power consumption - < 1 ma @ 3.3v, 11.0592 mhz (typical) - 3 ma typical @ 5.0v when disabled pin diagrams block diagram 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 1 19 18 16 15 14 13 12 11 17 18 17 15 14 13 12 11 10 16 20 osc2 osc1/clki v ss v ss v dd v dd baud1 cd cts rts tx rx ri dsr dtr txir rxir reset en baud0 v ss tx rx ri txir rxir reset en baud0 osc2 osc1/clki v dd baud1 cd cts rts dsr dtr mcp2155 mcp2155 pdip, soic ssop encode and protocol stack tx txir rx rxir en mcp2155 logic baud rate rts generator baud1 baud0 cd uart control cts dsr dtr ri osc1 osc2 protocol stack handler and handler decode irda ? standard protocol stack controller supporting dce applications 21690b.book page 1 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 2 preliminary ? 2001-2013 microchip technology inc. notes: 21690b.book page 2 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 3 mcp2155 1.0 device overview this document contains device specific information for the following device: ? mcp2155 the mcp2155 is a cost effective, low pin count (18- pin), easy to use device for implementing irda stan- dard wireless connectivity. the mcp2155 handles for the irda standard protocol ?stack? plus bit encoding/ decoding. the mcp2155 operates in data communi- cation equipment (dce) applications and sits between a uart and an infrared optical transceiver. the serial interface baud rates are user selectable to one of four irda standard baud rates between 9600 baud and 115.2 kbaud (9600, 19200, 57600, 115200). the ir baud rates are user selectable to one of five irda standard baud rates between 9600 baud and 115.2 kbaud (9600, 19200, 38400, 57600, 115200). the serial interface baud rate will be specified by the baud1:baud0 pins, while the ir baud rate is specified by the host controller. this means that the baud rates do not need to be the same. the mcp2155 encodes an asynchronous serial data stream, converting each data bit to the corresponding infrared (ir) formatted pulse. ir pulses that are received are decoded, and then handled by the proto- col handler state machine. the protocol handler will then send the appropriate data bytes to the host con- troller in uart formatted serial data. the mcp2155 supports ?point-to-point? applications. that is one primary device and one secondary device. the mcp2155 is a secondary device and does not sup- port ?multi-point? applications. sending data using ir light requires some hardware and the use of specialized communications protocols. these protocols and hardware requirements are described in detail by the irda standard specifications. the encoding/decoding functionality of the mcp2155 is designed to be compatible with the physical layer component of the irda standard. this part of the stan- dard is often referred to as ?irphy?. the complete irda standard specifications are avail- able for download from the irda website (www.irda.org) . 21690b.book page 3 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 4 preliminary ? 2001-2013 microchip technology inc. 1.1 applications the mcp2155 irda standard protocol stack controller supporting the irda standard for ircomm 9-wire ?cooked? service class which enables embedded sys- tem designers the easiest way to implement irda stan- dard wireless connectivity. figure 1-1 shows a typical application block diagram. table 1-2 shows the pin def- initions. table 1-1: overview of features infrared communication is a wireless two-way data connection using infrared light generated by low-cost transceiver signaling technology. this provides reliable communication between two devices. infrared technology offers: ? universal standard for connecting portable com- puting devices ? easy, effortless implementation ? economical alternative to other connectivity solu- tions ? reliable, high speed connection ? safe to use in any environment; can even be used during air travel ? eliminates the hassle of cables ? allows pc?s and other elctronic device?s (such as pda?s, cell phones, ....) to communicate with each other ? enhances mobility by allowing users to easily connect the mcp2155 allows the easy addition of irda stan- dard wireless connectivity to any embedded applica- tion that uses serial data. figure 1-1 shows typical implementation of the mcp2155 in an embedded sys- tem. the irda protocols for printer support are not included in the ircomm 9-wire ?cooked? service class. figure 1-1: system block diagram features mcp2155 serial communications: uart, ir baud rate selection: hardware low power mode: yes resets (and delays): reset , por (pwrt and ost) packages: 18-pin dip, soic, 20-pin ssop encode decode tx txir rx rxir en mcp2155 microcontroller tx rx optical uart txd rxd power down logic baud rate generator baud1 baud0 rts cd uart control cts dsr dtr ri transceiver 21690b.book page 4 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 5 mcp2155 table 1-2: pin description pin name pin number pin type buffer type description pdip soic ssop baud0 1 1 1 i st baud1:baud0 specify the baud rate of the device. for more information see section 2.5.1 . txir 2 2 2 o ? asynchronous transmit to infrared transceiver. rxir 3 3 3 i st asynchronous receive from infrared transceiver. reset 4 4 4 i st resets the device. v ss 5 5 5, 6 ? p ground reference for logic and i/o pins. en 6 6 7 i ttl device enable. 1 = device is enabled 0 = device is disabled (low power) tx 7 7 8 i ttl asynchronous receive; from host controller uart. rx 8 8 9 o ? asynchronous transmit; to host controller uart. ri 9 9 10 i ttl ring indicator. the state of this bit is communicated to the irda primary device. 1 = no ring indicate present 0 = ring indicate present dsr 10 10 11 o ? data set ready. indicates that the mcp2155 has established a valid link with a primary device. this signal is locally emulated and not related to the dtr bit of the irda primary device. 1 = an ir link has not been established (no ir link) 0 = an ir link has been established (ir link) dtr 11 11 12 i ttl data terminal ready. indicates that the embedded device con- nected to the mcp2155 is ready for ir data. the state of this bit is communicated to the irda primary device, via the irda bit car- ried by ircomm. 1 = embedded device not ready 0 = embedded device ready at device power-up, this signal is used with rts to enter device id programming. 1= enter device id programming mode (if rts is cleared) 0= do not enter device id programming mode cts 12 12 13 o ? clear to send. indicates that the mcp2155 is ready to receive data form the host controller. this signal is locally emulated and not related to the cts/rts bit of the irda primary device. 1 = host controller should not send data 0 = host controller may send data rts 13 13 14 i ttl request to send. indicates that the host controller is ready to receive data from the mcp2155. this signal is locally emulated and not related to the cts/rts bit of the irda primary device. 1 = host controller not ready to receive data 0 = host controller ready to receive data at device power-up, this signal is used with cts to enter device id programming. 1= do not enter device id programming mode 0= enter device id programming mode (if dtr is set) v dd 14 14 15, 16 ? p positive supply for logic and i/o pins. osc2 15 15 17 o ? oscillator crystal output. osc1/clkin 16 16 18 i cmos oscillator crystal input/external clock source input. legend: ttl = ttl compatible input st = schmitt trigger input with cmos levels i = input o = output p = power cmos = cmos compatible input 21690b.book page 5 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 6 preliminary ? 2001-2013 microchip technology inc. 1.1.1 signal directions table 1-3 shows the direction of the mcp2155 signals. the mcp2155 is designed for use in data communi- cation equipment (dce) applications. table 1-3: mcp2155 signal direction cd 17 17 19 i st carrier detect. the state of this bit is communicated to the irda primary device. 1 = no carrier present 0 = carrier present baud1 18 18 20 i st baud1:baud0 specify the baud rate of the device. for more information see section 2.5.1 . pin name pin number pin type buffer type description pdip soic ssop legend: ttl = ttl compatible input st = schmitt trigger input with cmos levels i = input o = output p = power cmos = cmos compatible input db-9 pin # signal direction comment 1cd hc ? mcp2155 carrier detect 2 rx mcp2155 ? hc received data 3tx hc ? mcp2155 transmit data 4dtr hc ? mcp2155 data terminal ready 5 gnd ? ground 6 dsr mcp2155 ? hc data set ready 7rts hc ? mcp2155 request to send 8 cts mcp2155 ? hc clear to send 9ri hc ? mcp2155 ring indicator legend: hc = host controller 21690b.book page 6 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 7 mcp2155 2.0 device operation the mcp2155 is a cost effective, low pin count (18- pin), easy to use device for implementing irda stan- dard wireless connectivity. the mcp2155 provides support for the irda standard protocol ?stack? plus bit encoding/decoding. the serial interface and ir baud rates are independantly selectable. 2.1 power-up any time that the device is powered up ( parameter d003 ), the power-up timer delay ( parameter 33 ) occurs, followed by an oscillator start-up timer (ost) delay ( parameter 32 ). after these two delays complete, communication with the device may be initiated. this communication is from both the infrared transceiver?s side as well as the controller?s uart interface. 2.2 device reset the mcp2155 is forced into the reset state when the reset pin is in the low state. after the reset pin is brought to a high state, the device reset sequence occurs. once the sequence completes, functional operation begins. 2.3 clock source the mcp2155 requires a clock source to operate. the frequency of this clock is 11.0592 mhz (electrical spec- ification parameter 1a ). this clock can be supplied by either a crystal/resonator or as an external clock input. 2.3.1 crystal oscillator / ceramic resonators a crystal or ceramic resonator can be connected to the osc1 and osc2 pins to establish oscillation ( figure 2-1 ). the mcp2155 oscillator design requires the use of a parallel cut crystal. use of a series cut crys- tal may give a frequency out of the crystal manufactur- ers specifications. figure 2-1: crystal operation (or ceramic resonator) table 2-1: capacitor selection for ceramic resonators table 2-2: capacitor selection for crystal oscillator 2.3.2 external clock in for applications where a clock is already available elsewhere, users may directly drive the mcp2155 pro- vided that this external clock source meets the ac/dc timing requirements listed in section 4.3 . figure 2-2 below shows how an external clock circuit should be configured. figure 2-2: external clock input operation see table 2-1 and table 2-2 for recommended values of c1 and c2. c1 c2 xtal osc2 rs osc1 rf to internal mcp2155 see note logic note: a series resistor may be required for at strip cut crystals. freq osc1 (c1) osc2 (c2) 11.0592 mhz 10 - 22 pf 10 - 22 pf higher capacitance increases the stability of the oscil- lator but also increases the start-up time. these val- ues are for design guidance only. since each resonator has its own characteristics, the user should consult the resonator manufacturer for appropriate values of external components. freq osc1 (c1) osc2 (c2) 11.0592 mhz 15 - 30 pf 15 - 30 pf higher capacitance increases the stability of the oscil- lator but also increases the start-up time. these val- ues are for design guidance only. r s may be required to avoid overdriving crystals with low drive level spec- ification. since each crystal has its own characteristics, the user should consult the crystal manufacturer for appropriate values of external com- ponents. clock from external mcp2155 osc1 osc2 open system 21690b.book page 7 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 8 preliminary ? 2001-2013 microchip technology inc. 2.4 bit clock the device crystal is used to derive the communication bit clock (bitclk). there are 16 bitclks for each bit time. the bitclks are used for the generation of the start bit and the eight data bits. the stop bit uses the bitclk when the data is transmitted (not for recep- tion). this clock is a fixed frequency, and has minimal varia- tion in frequency (specified by crystal manufacturer). 2.5 uart interface the uart interface communicates with the "control- ler". this interface is a half duplex interface, meaning that the system is either transmitting or receiving, but not both at the same time. 2.5.1 baud rate the baud rate for the mcp2155 serial port (the tx and rx pins) is configured by the state of the baud1 and baud0 pins. these two device pins are used to select the baud rate that the mcp2155 will transmit and receive serial data (not ir data). table 2-3 shows the baud rate configurations. table 2-3: serial baud rate selection vs. frequency 2.5.2 transmitting when the controller sends serial data to the mcp2155, the controller?s baud rate is required to match the baud rate of the mcp2155?s serial port. 2.5.3 receiving when the controller receives serial data from the mcp2155, the controller?s baud rate is required to match the baud rate of the mcp2155?s serial port. baud1:baud0 baud rate @ 11.0592 mhz bit rate 00 9600 f osc / 1152 01 19200 f osc / 576 10 57600 f osc / 192 11 115200 f osc / 96 21690b.book page 8 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 9 mcp2155 2.6 modulation the data that the mcp2155 uart received (on the tx pin) that needs to be transmitted (on the txir pin), will need to be modulated. this modulated signal drives the ir transceiver module. figure 2-3 shows the encoding of the modulated signal. each bit time is comprised of 16-bit clocks. if the value to be transmitted (as determined by the tx pin) is a logic low, then the txir pin will output a low level for 7-bit clock cycles, a logic high level for 3-bit clock cycles or a minimum of 1.6 ? s (see parameter ir121 ), and then the remaining 6-bit clock cycles (or difference up to the 16-bit clock time) will be low. if the value to transmit is a logic high, then the txir pin will output a low level for the entire 16-bit clock cycles. 2.7 demodulation the modulated signal (data) from the ir transceiver module (on rxir pin) needs to be demodulated to form the received data (on rx pin). after demodulation of the data byte occurs, the data that is received is trans- mitted by the mcp2155 uart (on the rx pin). figure 2-4 shows the decoding of the modulated signal. each bit time is comprised of 16 bit clocks. if the value to be received is a logic low, then the rxir pin will be a low level for the first 3-bit clock cycles or a minimum of 1.6 s, and then the remaining 13-bit clock cycles (or difference up to the 16-bit clock time) will be high. if the value to be received is a logic high, then the rxir pin will be a high level for the entire 16-bit clock cycles. the level on the rx pin will be in the appropriate state for the entire 16 clock cycles. figure 2-3: encoding figure 2-4: decoding note: the signal on the txir pin does not actu- ally line up in time with the bit value that was transmitted on the tx pin as shown in figure 2-3 . the tx bit value is shown to represent the value to be transmitted on the txir pin. note: the signal on the rx pin does not actually line up in time with the bit value that was received on the rxir pin as shown in figure 2-4 . the rxir bit value is shown to represent the value to be transmitted on the rx pin. bitclk tx bit txir 0100 0 1 16 clk 7 clk start bit data bit 0 data bit 1 data bit 2 data bit ... 24 tosc value bitclk rx rxir bit 0100 0 1 ? 1.6 s (up to 3 clk) ? 13 clk 16 clk 16 clk 16 clk 16 clk 16 clk 16 clk 16 clk start bit data bit 0 data bit 1 data bit 2 data bit ... (clk) value 21690b.book page 9 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 10 preliminary ? 2001-2013 microchip technology inc. 2.8 minimizing power the device can be placed in a low power mode by dis- abling the device (holding the en pin at the low state). the internal state machine is monitoring this pin for a low level, and once this is detected the device is dis- abled and enters into a low power state. 2.8.1 returning to device operation when disabled, the device is in a low power state. when the en pin is brought to a high level, the device will return to the operating mode. the device requires a delay of 1024 t osc before data may be transmitted or received. 2.9 network layering reference model figure 2-5 shows the iso network layering reference model. the shaded areas are implemented by the mcp2155, the cross-hatched area is implemented by an infrared transceiver, and the unshaded areas need to be implemented by the host controller. figure 2-5: iso reference layer model osi reference layers application presentation session transport network data link layer llc (logical link control) acceptance filtering overload notification recovery management mac (medium access control) data encapsulation/decapsulation frame coding (stuffing, destuffing) medium access management error detection error signaling acknowledgment serialization/deserialization physical layer pls (physical signalling) bit encoding/decoding bit timing synchronization pma (physical medium attachment) driver/receiver characteristics mdi (medium dependent interface) connectors fault confinement (mac-lme) bus failure management (pls-lme) supervisor regions implemented by the mcp2155 has to be implemented in host controller firmware regions implemented by the optical transceiver logic (such as a pic ? microcontroller) 21690b.book page 10 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 11 mcp2155 the irda standard specifies the following protocols: ? physical signaling layer (phy) ? link access protocol (irlap) ? link management protocol/information access service (irlmp/ias) the irda data lists optional protocols. these are: ?tiny tp ? irtran-p ? irobex ?irlan ?ircomm ?irmc ?irda lite figure 2-6 shows the irda data protocol stack and which components are implemented by the mcp2155. figure 2-6: irda data - protocol stacks 2.9.1 irda data protocols supported by mcp2155 the mcp2155 supports these required irda standard protocols: ? physical signaling layer (phy) ? link access protocol (irlap) ? link management protocol/information access service (irlmp/ias) the mcp2155 also supports some of the optional pro- tocols for irda data. the optional protocols that the mcp2155 implements are: ?tiny tp ?ircomm 2.9.1.1 physical signal layer (phy) the mcp2155 provides the following physical signal layer specification support: ? bi-directional communication ? data packets are protected by a crc - 16-bit crc for speeds up to 115.2 kbaud ? data communication rate - 9600 baud minimum data rate (with primary speed/cost steps of 115.2 kbaud) the following physical layer specification is depen- dant on the optical transceiver logic used in the appli- cation. the specification states: ? communication range, which sets the end user expectation for discovery, recognition and perfor- mance - continuous operation from contact to at least 1 meter (typically 2 meters can be reached) - a low power specification reduces the objec- tive for operation from contact to at least 20 cm (low power and low power) or 30 cm (low power and standard power). ircomm (1) ir link management - mux (irlmp) ir link access protocol (irlap) optional irda data protocols not supported by the mcp2155 supported by the mcp2155 irtran-p irobex irlan irmc lm-ias tiny transport protocol (tiny tp) synchronous 4 ppm (4 mb/s) synchronous serial ir (1.152 mb/s) asynchronous serial ir (2) (9600 -115200 b/s) note 1: the mcp2155 implements the 9-wire ?cooked" service class serial replicator 2: an optical transceiver is required 21690b.book page 11 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 12 preliminary ? 2001-2013 microchip technology inc. 2.9.1.2 irlap the mcp2155 supports the irlap protocol. the irlap protocol provides: ? management of communication processes on the link between devices. ? a device-to-device connection for the reliable, ordered transfer of data. ? device discover procedures. ? hidden node handling. (not supported by mcp2155) figure 2-7 identifies the key parts and hierarchy of the irda protocols. the bottom layer is the physical layer, irphy. this is the part that converts the serial data to and from pulses of ir light. ir transceivers can?t trans- mit and receive at the same time. the receiver has to wait for the transmitter to finish sending. this is some- times referred to as a ?half-duplex? connection. the ir link access protocol (irlap) provides the structure for packets or ?frames? of data to emulate data that would normally be free to stream back and forth. figure 2-7: irda standard protocol layers figure 2-8 shows how the irlap frame is organized. the frame is proceeded by some number of beginning of frame characters,(bofs). the value of the bof is generally 0xc0, but 0xff may be used if the last bof character is a 0xc0. the purpose of multiple bofs is to give the other station some warning that a frame is coming. the irlap frame begins with an address byte (?a? field), then a control byte (?c? field). the control byte is used to differentiate between different types of frames and is also used to count frames. frames can carry sta- tus, data, or commands. the irlap protocol has a com- mand syntax of it?s own, and these commands are part of the control byte. lastly, irlap frames carry data. this data is the information or ?i? field. the integrity of the frame is ensured with a 16-bit crc, referred to as the frame check sequence (fcs). the 16-bit crc value is transmitted lsb first. the end of the frame is marked with an eof character which is always a 0xc1. the frame structure described here is used for all versions of irda protocols used for serial wire replacement for speeds up to 115.2 kbaud. figure 2-8: irlap frame in addition to defining the frame structure, irlap pro- vides the ?housekeeping? function of opening and clos- ing connections, and maintaining connections once they?re open. the critical parameters that determine the performance of the link are part of this function. these parameters control how many bofs are used, identify the speed of the link, how fast either party may change from receiving to transmitting, etc. irlap has the responsibility of negotiating these parameters to the highest common set so that both sides can commu- nicate as fast and as reliably as possible. host o.s. or application ircomm irlap irphy protocols resident in mcp2155 ir pulses transmitted and received irlmp ? ias note 1: another irda standard which is entering general usage is ir object exchange (irobex). this standard is not used for serial connection emulation. 2: irda communication standards faster than 115.2 kbaud use a different crc method and physical layer. x bofs bof a c fcs i eof (1+n) of c0h payload 2 bytes c1h 21690b.book page 12 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 13 mcp2155 2.9.1.3 irlmp the mcp2155 implements the irlmp protocol. the irlmp protocol provides: ? multiplexing of the irlap layer. this allows multi- ple channels above an irlap connection ? protocol and service discovery. this is via the information access service (ias) when two devices that contain the irda standard fea- ture are connected, there is generally one device that has something to do, and the other device has the resource to do it. for example, a laptop may have a job to print and an irda standard compatible printer has the resources to print it. in irda standard terminology, the laptop is a primary device and the printer is the sec- ondary device. when these two devices connect, the primary device must determine the capablities of the secondary device to determine if the secondary device is capable of doing the job. this determination is made by the primary device asking the secondary device a series of questions. depending on the answers to these questions the primary device may or may not elect to connect to the secondary device. the queries from the primary device are carried to the secondary device using irlmp. the responses to these queries can be found in the information access service (ias) of the secondary device. the ias is a list of the resources of the secondary device. the primary device compares the ias responses with its require- ments and then makes the decision if a connection should be made. the mcp2155 identifies itself to the primary device as a modem. 2.9.1.4 link management - information access service (lm-ias) the mcp2155 implements the lm-ias. each lm-ias entity maintains an information data base to provide: ? information on services for other devices that con- tain the irda standard feature (discovery) ? information on services for the device itself ? remote accessing of another device?s information base this is required so that clients on a remote device can find configuration information needed to access a ser- vice. 2.9.1.5 tiny tp tiny tp provides the flow control on irlmp connec- tions. an optional service of segmentation and reas- sembly can be handled. 2.9.1.6 ircomm ircomm provides the method to support serial and par- allel port emulation. this is useful for legacy com applications, such as printers and modem devices. the ircomm standard is simply a syntax that allows the primary device to consider the secondary device as a serial device. ircomm allows for emulation of serial or parallel (printer) connections of various capa- bilities. the mcp2155 supports the 9-wire ?cooked? service class of ircomm. other service classes sup- ported by ircomm are shown in figure 2-9 . figure 2-9: ircomm service classes note: the mcp2155 identifies itself as a modem to ensure that it is identified as a serial device with a limited amount of memory. ircomm services uncooked services cooked services parallel serial irlpt 3-wire raw parallel centronics ieee 1284 serial 3-wire cooked 9-wire cooked supported by mcp2155 21690b.book page 13 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 14 preliminary ? 2001-2013 microchip technology inc. 2.9.2 other optional irda data protocols other irda data protocols have been developed to spe- cific application requirements. these optional protocols are not supported in the mcp2155. these irda data protocols are briefly described in the following sub-sec- tions. for additional information, please refer to the irda website (www.irda.org) . 2.9.2.1 irtran-p irtran-p provides the protocol to exchange images with digital image capture devices/cameras. 2.9.2.2 irobex irobex provides object exchange services. this is similar to http. 2.9.2.3 irlan irlan describes a protocol to support ir wireless access to a local area network (lan). 2.9.2.4 irmc irmc describes how mobile telephony and communica- tion devices can exchange information. this informa- tion includes phonebook, calender, and message data. also how call control and real-time voice are handled (rtcon). 2.9.2.5 irda lite irda lite describes how to reduce the application code requirements, while maintaining compatibility with the full implementation. 21690b.book page 14 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 15 mcp2155 2.9.3 how devices connect when two devices implementing the irda standard fea- ture establish a connection using the ircomm protocol, the process is analogous to connecting two devices with serial ports using a cable. this is referred to as a "point-to-point" connection. this connection is limited to half-duplex operation because the ir transceiver cannot transmit and receive at the same time. the pur- pose of the irda protocol is to allow this half-duplex link to emulate, as much as possible, a full-duplex connec- tion. in general, this is done by dividing the data into ?packets?, or groups of data. these packets can then be sent back and forth when needed without risk of col- lision. the rules of how and when these packets are sent constitute the irda protocols. the mcp2155 sup- ports elements of this irda protocol to communicate with other irda standard compatible devices. when a wired connection is used, the assumption is made that both sides have the same communications parameters and features. a wired connection has no need to identify the other connector, because it is assumed that the connectors are properly connected. in the irda standard, a connection process has been defined to identify other irda compatible devices and establish a communication link. there are three steps that these two devices go through to make this connec- tion. these are: ? normal disconnect mode (ndm) ? discovery mode ? normal connect mode (ncm) figure 2-10 shows the connection sequence. 2.9.3.1 normal disconnect mode (ndm) when two irda standard compatible devices come into range they must first recognize each other. the basis of this process is that one device has some task to accomplish and the other device has a resource needed to accomplish this task. one device is referred to as a primary device and the other is referred to as a secondary device. this distinction between primary device and secondary device is important. it is the responsibility of the primary device to provide the mechanism to recognize other devices. so the primary device must first poll for nearby irda standard compat- ible devices. during this polling, the defaut baud rate of 9600 baud is used by both devices. for example, if you want to print from an irda equipped laptop to an irda printer utilizing the irda standard feature, you would first bring your laptop in range of the printer. in this case, the laptop is the one that has something to do and the printer has the resource to do it. the laptop is called the primary device and the printer is the secondary device. some data-capable cellphones have irda standard infrared ports. if you used such a cellphone with a personal dig- ital assistants (pdas), the pda that supports the irda standard feature would be the primary device and the cellphone would be the secondary device. when a primary device polls for another device, then a nearby secondary device may respond. when a sec- ondary device responds, the two devices are defined to be in the normal disconnect mode (ndm) state. ndm is established by the primary device broadcasting a packet and waiting for a response. these broadcast packets are numbered. usually 6 or 8 packets are sent. the first packet is number 0, the last packet is usually number 5 or 7. after all the packets are sent, the pri- mary device then sends an id packet which is not num- bered. the secondary device waits for these packets, and then responds to one of the packets. the packet it responds to determines the ?time slot? to be used by the secondary device. for example, if the secondary device responds after packet number 2, then the sec- ondary device will use time slot 2. if the secondary device responds after packet number 0, then the sec- ondary device will use time slot 0. this mechanism allows the primary device to recognize as many nearby devices as there are time slots. the primary device will continue to generate time slots and the secondary device should continue to respond, even if there?s noth- ing to do. during ndm, the mcp2155 handles all of the responses to the primary device (see figure 2-10 ), without any communication with the host controller. the host controller is inhibited by the cts signal, of the mcp2155, from sending data to the mcp2155. note 1: the mcp2155 can only be used to implement a secondary device. 2: the mcp2155 supports a system with only one secondary device having exclu- sive use of the irda standard infrared link (known as "point-to-point" communica- tion). 3: the mcp2155 always takes time slot 2. 4: if another secondary device is nearby, the primary device may fail to recognize the mcp2155, or the primary device may not recognize either of the devices. 21690b.book page 15 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 16 preliminary ? 2001-2013 microchip technology inc. 2.9.3.2 discovery mode discovery mode allows the primay device to determine the capabilities of the secondary device. the discovery mode is entered after the mcp2155 (secondary device) has sent an xid response to the primary device, and the primary device has completed sending the xids and then sends a broadcast id. if this sequence is not completed, then a primary device and a secondary device can stay in ndm indefinitely. when the primary device has something to do, it then initiates discovery. discovery has two parts. these are: ? link initialization ? resource determination the first step is for the primary device and secondary device to determine and then adjust to each other?s hardware capabilities. these capabilities are parame- ters like: ?data rate ? turn around time ? number of packets without a response ? how long to wait before disconnecting both the primary device and secondary device begin communications at 9600 baud, which is the default baud rate. the primary device sends its parameters, then the secondary device responds with its parame- ters. for example, if the primary supports all data rates up to 115.2 kbaud and the secondary device only sup- ports 19.2 kbaud then the link will be established at 19.2 kbaud. after the hardware parameters are established, the pri- mary device must determine if the secondary device has the resources it requires. if the primary device has a job to print, then it has to know if it?s talking to a printer, not a modem or other device. this determina- tion is made using the information access service, (ias). the job of the secondary device is to respond to ias queries made by the primary device. the primary device must ask a series of questions like: ? what is the name of your service? ? what is the address of this service? ? what are the capabilities of this device? when all the primary device?s questions are answered, the primary device can access the service provided by the secondary device. during discovery mode, the mcp2155 handles all of the responses to the primary device (see figure 2-10 ), without any communication with the host controller. the host controller is inhibited by the cts signal, of the mcp2155, from sending data to the mcp2155. 2.9.3.3 normal connect mode (ncm) after discovery has been completed, the primary device and mcp2155 (secondary device) can freely exchange data. the mcp2155 can receive ir data or serial data, but not both at the same time. the mcp2155 uses a hard- ware handshake to stop the local serial port from send- ing data while the mcp2155 is receiving ir data. both the primary device and mcp2155 (secondary device) check to make sure that data packets are received by the other without errors. even when data is required to be sent the primary device and secondary device will still exchange packets just to make sure that the connection hasn?t unexpectedly been dropped. when the primary device has finished, it then transmits the close link command to the mcp2155 (secondary device). the mcp2155 will confirm the close link com- mand, and then both the primary device and mcp2155 (secondary device) will revert to the ndm state. it is the responsability of the host controller program to understand the meaning of the data received, and how the program should respond to it. this is the same as if the data was being received by the host controller from a uart. note: the mcp2155 is limited to a data rate of 115.2 kbaud. note: data loss will result if this hardware hand- shake is not observed. note: if the ncm mode is unexpectedly termi- nated for any reason (including the primary device not issuing a close link command), the mcp2155 will revert to the ndm state 10 seconds after the last frame has been received. 21690b.book page 16 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 17 mcp2155 figure 2-10: connection sequence normal disconnect mode (ndm) send xid commands (timeslots n, n+1, ...) no response xid response in timeslot y finish sending xids (max timeslots - y frames) broadcast id no response to these xids (claiming this timeslot) no response to broadcast id primary device secondary device discovery normal response mode (nrm) send snrm command (w/ parameters and connection address) open channel for ias queries send ias queries open channel for data send data or status shutdown link ua response with parameters using connect address confirm channel open for ias provide ias responses confirm channel open for data send data or status confirm shutdown (back to ndm state) (approximately 70ms between xid commands) send data or status send data or status 21690b.book page 17 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 18 preliminary ? 2001-2013 microchip technology inc. 2.10 operation the mcp2155 emulates a modem connection. the application on the dce device sees a virtual serial port. this serial port emulation is provided by the irda stan- dard protocols. the link between the dce device and the embedded application is made using the mcp2155. the connection between the mcp2155 and the embedded application should be wired as a modem connection. the data set ready (dsr) signal of the mcp2155 is used to indicate if a valid irda standard infrared link has been established between the mcp2155 and the pri- mary device (dce host). the dsr signal should be monitored closely to make sure that any communica- tion tasks can be completed. to indicate that the mcp2155 has powered-up, suc- cessfully initialized, and is ready for service, monitor the cts signal for a high level. the cts signal is driven high during the ndm and discovery states, and may be either high or low during the ncm state. the mcp2155 generates the cts signal locally. 2.10.1 hardware handshaking the mcp2155 uses a 64-byte buffer for incoming data from the ir host. another 64-byte buffer is provided to buffer data from the uart serial port. when an ir packet begins the ircomm, the mcp2155 handles ir data exclusively. so the uart serial port buffer is not available. a hardware handshaking pin (cts) is pro- vided to inhibit the host controller from sending serial data while ir data is being sent or received. 2.10.2 buffers and throughput the maximum ir data rate of the mcp2155 is 115.2 kbaud. the actual throughput will be less due to several factors, the most significant of which are under the control of the developer. one factor beyond the control of the designer is the overhead associated with the irda standard. the mcp2155 uses a fixed data block size of 64-bytes. to carry 64 bytes of data the mcp2155 must send 72 bytes (64+8). the additional 8 bytes are used by the protocol. when the primary device receives the frame it must wait for a minimum latency period before sending a packet of its own. this turnaround time is set by irlap when the parameters of the link are negotiated. a common turnaround time is 1ms, although longer and shorter times may be encountered. 1 ms represents approximately 12 byte times at a data rate of 115.2 kbaud. the minimum size frame that the primary device can respond with is 6 bytes. the mcp2155 will add the 12 byte-time latency of its own, again assuming a 1ms latency. this means that the maximum throughput will be 64 data bytes out of a total of 64 + 38 byte times. thus, the maximum the- oretical throughput will be limited to about 64/ (64+38)=63% of the ir data rate. actual maximum throughput will between 38.4 kbaud and 57.6 kbaud. this difference is due to processing time of the receiv- ing station and other factors. the most significant factor in data throughput is how well the data frames are filled. if only 1 byte is sent at a time, then the maximum throughput is 1/(1+38)=2.5% of the ir data rate. the best way to maximize through- put is to align the amounts of data with the packet size of the mcp2155. throughput examples are shown in table 2-4 . table 2-4: irda standard throughput examples @ 115.2 kbaud note: the rts and cts signals are local emula- tions. note: when the cts output from the ircomm is high, no data should be sent from the host controller. the uart fifo will store up to 2 bytes. any additional data bytes will be lost. mcp2155 data packet size (bytes) overhead (bytes) primary device minimum response (bytes) primary device turn-around time (1) (bytes) mcp2155 turn-around time (1) (bytes) total bytes transmitted throughput % (data/total) 64 8 6 12 12 102 62.7% 18 6 12 12 392.6% note 1: number of bytes calculated based on a common turnaround time of 1 ms. 21690b.book page 18 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 19 mcp2155 2.11 turnaround latency an ir link can be compared to a one-wire data connec- tion. the ir transceiver can transmit or receive, but not both at the same time. a delay of one bit time is sug- gested between the time a byte is received and another byte is transmitted. 2.12 ir port baud rate the baud rate for the mcp2155 ir port (the txir and rxir pins) is initially at the default rate of 9600 baud. the host controller will determine the maximum baud rate that the mcp2155 can support. this information is used during ndm with the primary device to set the baud rate of the ir link. the maximum ir baud rate is not required to be the same as the mcp2155?s serial port (uart) baud rate (as determined by the baud1:baud0 pins). 2.13 programmable device id the mcp2155 has a flexible feature that allows the mcp2155 device id to be changed by the host control- ler. the default id is ?generic irda?, and is stored in non-volatile electrically erasable programmable mem- ory (eeprom). the maximum id string length is 19 bytes. the format of the id eeprom is shown in figure 2-11 . the id string must only contain the ascii characters from 20h to 7ah (inclusive). the mcp2155 enters into id string programming when the mcp2155 exits the reset state and detects that the dtr pin is high and the rts pin is low. a host controller connected to the mcp2155 would typically do the following steps to place the mcp2155 into id string programming mode: 1. force the mcp2155 into reset (reset pin forced low). 2. force the dtr pin high and the rts pin low. 3. release the mcp2155 from reset (reset pin forced high). once the mcp2155 is ready to receive data, the cts pin will be forced low. data may now be transferred, fol- lowing the format in figure 2-11 . the cts pin deter- mines the flow control, and the host controller must monitor this signal to ensure that the data byte may be sent. once the host controller has sent its last byte, the dtr pin must be set low. this ensures that if another reset occurs, the mcp2155 will not re-enter id string pro- gramming mode. the mcp2155 uses the string length (1st byte transmitted) to determine when to id string programming mode has completed. this returns the mcp2155 to normal operation. example 2-1 show the firmware code for a pic16cxxx acting as the host controller to modify the mcp2155 device id string. figure 2-11: id string format note 1: if a non-valid id string (contains an ascii character not in the valid range) is programmed, the mcp2155 will not create a link with a primary device. 2: the communication program that is sup- plied with microsoft windows operating sys- tem (called hyper terminal), may leave the dtr signal high and the rts signals low when the program disconnects, or is closed. care should be taken to ensure that this could not accidently cause the mcp2155 to enter device id sting programming. length id string 1 byte 1 to 19 bytes 1st byte transferred last byte transferred 21690b.book page 19 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 20 preliminary ? 2001-2013 microchip technology inc. example 2-1: pic16fxx code to program the device id ;#define dtr portx, pinx ; must specify which port and which pin ;#define cts portx, pinx ; must specify which port and which pin ;#define rts portx, pinx ; must specify which port and which pin ;#define clr portx, pinx ; must specify which port and which pin ; ;***************************************************************** ; string table ; this table stores a string, breg is the offset. the string ; is terminated by a null character. ;***************************************************************** string1 clrf pclath ; this routine is on page 0 movf breg, w ; get the offset addwf pcl, f ; add the offset to pc dt d'15' ; the first byte is the byte count dt "my ir id string" ; updateid call deviceinit ; initialize the pic16fxxx bcf clr ; place the mcp2155 in reset bsf dtr ; force the dtr pin high for program mode bcf rts ; force the rts pin low for program mode call delay1ms ; delay for 1 ms. bsf clr ; allow the mcp2155 to come out of reset ; clrf loopcnt ; loopcnt = 0 ctslp1 call delay1ms ; delay for 1 ms. btfss cts ; if cts=0 then we're ready to program goto ctslow ; mcp2155 is ready to receive data decfsz loopcnt, f ; goto ctslp1 ; no, wait for mcp2155 to be ready goto stuckreset ; the mcp2150 did not exit reset, do your recovery ; in this routine. 21690b.book page 20 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 21 mcp2155 example 2-1: pic16fxx code to program the device id (continued) ctslow clrf breg ; clear the offset call string1 ; get the byte count ; (id length byte + # bytes in string) movwf creg ; use creg as the loop counter incf creg, f ; add 1 to the loop count since ; we're jumping into the middle movwf areg ; save the count in areg to send it goto sndwt ; start sending the count + id string ; sndlp call string1 ; get the byte movwf areg ; save the byte sndwt btfsc cts ; check the cts input goto sndwt ; wait if cts=1 call txser ; send the byte using the transmit routine incf breg,f ; increment the table pointer decfsz creg, f ; more bytes to send? goto sndlp ; yes, send more bytes ; bcf clr ; no, place the mcp2155 in reset bcf dtr ; force the dtr pin low for normal mode bsf rts ; force the rts pin high for normal mode call delay1ms ; delay for 1 ms. bsf clr ; allow the mcp2155 to come out of reset ; ctslp2 btfss cts ; if cts=1 then mcp2155 is in normal mode goto ctslp2 ; no, wait for mcp2155 to be ready goto normaloperation ; the mcp2155 in now programmed with new id, ; and is ready to establish an ir link 21690b.book page 21 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 22 preliminary ? 2001-2013 microchip technology inc. 2.14 optical transceiver the mcp2155 requires an infrared transceiver. the transceiver can be a integrated solution. ta b l e 2 - 5 shows a list of common manufacturers of integrated optical transceivers. a typical optical transceiver circuit using a vishay/temic tfds4500 is shown in figure 2- 12 . figure 2-12: typical optical transceiver circuit the optical transceiver logic can be implemented with discrete components, for component cost savings. care must be taken in the design and layout of the photo detect circuit. this is due to the small signals that are being detected and their sensitivity to noise. a dis- crete implementation of the optical transceiver logic is implemented on the mcp2120 and mcp2150 devel- oper?s kit boards. 2.15 references the irda standards download page can be found at: http://www.irda.org/standards/specifications some common manufacturers of optical transceivers are shown in ta b l e 2 - 5 . table 2-5: common optical transceiver manufacturers note: the discrete optical transceiver implemen- tation on the mcp2120 and mcp2150 developer?s kit boards may not meet the irda specifications for the physical layer (irphy). any discrete solution will require appropriate validation for the user?s appli- cation. +5v +5v r11 22 ? tfds4500 u6 8 7 6 5 47 ? r13 1 2 3 4 c18 .1 ? f rxir pin 3) (to mcp2155 pin 2) txir (to mcp2155 company company web site address infineon www.infineon.com agilent www.agilent.com vishay/temic www.vishay.com rohm www.rohm.com 21690b.book page 22 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 23 mcp2155 3.0 development tools the mcp2155 is supported by the mcp2120/ mcp2150 developer?s kit (order number dm163008). this kit allows the user to demonstrate the operation of the mcp2155 by doing some hardware ?cuts? on the mcp2150 developer?s board. each kit (dm163008) comes with two mcp2120 devel- oper?s boards and one mcp2150 developer?s board to demonstrate transmission/reception of infrared data streams. figure 3-1 shows a block diagram of the mcp2150 developer?s board and the 4 lines that are to be ?cut?. the use of mcp2155 requires that the header interface is used (sp3238e disconnected from sys- tem). as can be seen, the user has jumper options for both the interface to the host controller (uart or header) and the transceiver solution (integrated or discrete component). the uart interface allows a direct connection to a pc (use a terminal emulation program), or a header to allow easy connection to host prototypes (or one of the microchip picdem? boards). the transceiver logic is jumpered to allow the selection of either a single chip transceiver solution, or a low cost discrete solution. this low cost discrete solution allows a lower system cost to be achieved. with the lower cost comes some trade-offs of the irda standard physical layer specifications. these trade-offs need to be evalu- ated to ensure the characteristics of the component solution meet the requirements of the system. this kit comes with two identical mcp2120 devel- oper?s boards and a single mcp2150 developer?s board. this allows a complete system (transmitter and receiver) to be implemented with either system requirement (simple encoder/decoder or irda standard protocol stack plus encoder/decoder). figure 3-1: mcp2150 developer?s kit block diagram db9 power header sp3238e power led integrated transceiver component mcp601 +5v gnd 9v battery host interface power supply 7 4 4 4 signal lines to be ?cut? mcp2155 (note) note: the mcp2150 which comes standard in the mcp2150 developer?s kit may be replaced with the mcp2155. some signals from the uart drive chip (sp3238e) need to be cut in order to ensure that no i/o conflicts will occur. 21690b.book page 23 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 24 preliminary ? 2001-2013 microchip technology inc. notes: 21690b.book page 24 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 25 mcp2155 4.0 electrical characteristics absolute maximum ratings? ambient temperature under bias ................................................................................................. .......... ?40c to +125c storage temperature ............................................................................................................ ................. ?65c to +150c voltage on v dd with respect to v ss ........................................................................................................... -0.3v to +6.5v voltage on reset with respect to v ss ...................................................................................................... -0.3v to +14v voltage on all other pins with respect to v ss ................................................................................. ?0.3v to (v dd + 0.3v) total power dissipation (1) ............................................................................................................................... ....800 mw max. current out of v ss pin ........................................................................................................................... .......300 ma max. current into v dd pin ........................................................................................................................... ..........250 ma input clamp current, i ik (vi < 0 or vi > v dd ) ??????????????????????????????????????????????????????????????? ???????????????????????????????????????????????????? ? 20 ma output clamp current, i ok (v0 < 0 or v0 > v dd ) ??????????????????????????????????????????????????????????????? ?????????????????????????????????????????????? ? 20 ma max. output current sunk by any output pin..................................................................................... .....................25 ma max. output current sourced by any output pin.................................................................................. ...................25 ma note 1: power dissipation is calculated as follows: p dis = v dd x {i dd - ? i oh } + ? {(v dd -v oh ) x i oh } + ? (v ol x i ol ) ? notice: stresses above those listed under "maximum ratings" may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. 21690b.book page 25 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 26 preliminary ? 2001-2013 microchip technology inc. figure 4-1: voltage-frequency graph, -40 ? c ? t a ? +85 ? c 6.0 2.5 4.0 3.0 0 3.5 4.5 5.0 5.5 410 frequency (mhz) v dd 20 (volts) 81216 11.0592 21690b.book page 26 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 27 mcp2155 4.1 dc characteristics dc characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) param. no. sym characteristic min typ (1) max units conditions d001 v dd supply voltage 3.0 ? 5.5 v see figure 4-1 d002 v dr ram data retention voltage (2) 2.0 ? ? v device oscillator/clock stopped d003 v por v dd start voltage to ensure power-on reset ?v ss ?v d004 sv dd v dd rise rate to ensure power-on reset 0.05 ? ? v/ms d010 i dd supply current (3) ? ? ? 4.0 2.2 7.0 ma ma f osc = 11.0592 mhz, v dd = 3.0v f osc = 11.0592 mhz, v dd = 5.5v d020 i pd device disabled current (3, 4) ? ? ? ? 2.2 9 a a v dd = 3.0v v dd = 5.5v note 1: data in the typical (?typ?) column is based on characterization results at 25 ? c. this data is for design guid- ance only and is not tested. 2: this is the limit to which v dd can be lowered without losing ram data. 3: the supply current is mainly a function of the operating voltage and frequency. pin loading, pin rate, and temperature have an impact on the current consumption. a) the test conditions for all i dd measurements are made when device is enabled (en pin is high): osc1 = external square wave, from rail-to-rail; all input pins pulled to v ss , rxir = v dd , reset = v dd ; b) when device is disabled (en pin is low), the conditions for current measurements are the same. 4: when the device is disabled (en pin is low), current is measured with all input pins tied to v dd or v ss and the output pins driving a high or low level into infinite impedance. 21690b.book page 27 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 28 preliminary ? 2001-2013 microchip technology inc. dc characteristics (continued) dc characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40c ? t a ? +85c (industrial) operating voltage v dd range as described in dc spec section 4.1 . param no. sym characteristic min typ max units conditions input low voltage v il input pins d030 with ttl buffer (tx, ri, dtr, rts, cd, and en) v ss ?0.8v v4.5 ? v dd ?? 5.5v d030a v ss ? 0.15v dd votherwise d031 with schmitt trigger buffer (baud1, baud0, and rxir) v ss ?0.2v dd v d032 reset v ss ?0.2v dd v d033 osc1 v ss ?0.3v dd v input high voltage v ih input pins ? d040 with ttl buffer (tx, ri, dtr, rts, cd, and en) 2.0 ? v dd v4.5 ? v dd ?? 5.5v d040a 0.25v dd + 0.8 ?v dd v otherwise d041 with schmitt trigger buffer (baud1, baud0, and rxir) 0.8v dd ?v dd v d042 reset 0.8v dd ?v dd v d043 osc1 0.7v dd ?v dd v input leakage current (notes 1, 2) d060 i il input pins ? ? 1 a v ss ?? v pin ?? v dd , pin at hi-impedance d061 reset ??5av ss ?? v pin ?? v dd d063 osc1 ? ? 5 a v ss ?? v pin ?? v dd note 1: the leakage current on the reset pin is strongly dependent on the applied voltage level. the specified lev- els represent normal operating conditions. higher leakage current may be measured at different input volt- ages. 2: negative current is defined as coming out of the pin. 21690b.book page 28 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 29 mcp2155 dc characteristics (continued) dc characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40c ? t a ? +85c (industrial) operating voltage v dd range as described in dc spec section 4.1 param no. sym characteristic min typ max units conditions output low voltage d080 v ol txir, rx, dsr, and cts pins ? ? 0.6 v i ol = 8.5 ma, v dd = 4.5v d083 osc2 ? ? 0.6 v i ol = 1.6 ma, v dd = 4.5v output high voltage d090 v oh txir, rx, dsr, and cts pins (note 1) v dd - 0.7 ? ? v i oh = -3.0 ma, v dd = 4.5v d092 osc2 v dd - 0.7 ? ? v i oh = -1.3 ma, v dd = 4.5v capacitive loading specs on output pins d100 c osc 2 osc2 pin ? ? 15 pf when external clock is used to drive osc1. d101 c io all input or output pins ? ? 50 pf note 1: negative current is defined as coming out of the pin. 21690b.book page 29 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 30 preliminary ? 2001-2013 microchip technology inc. 4.2 timing parameter symbology and load conditions the timing parameter symbols have been created following one of the following formats: 4.2.1 timing conditions the temperature and voltages specified in table 4-2 apply to all timing specifications unless otherwise noted. figure 4- 2 specifies the load conditions for the timing specifications. table 4-1: symbology table 4-2: ac temperature and voltage specifications figure 4-2: load conditions for device timing specifications 1. tpps2pps 2. tpps t f frequency t time eerror lowercase letters (pp) and their meanings: pp io input or output pin osc oscillator rx receive tx transmit bitclk rx/tx bitclk rst reset drt device reset timer uppercase letters and their meanings: s f fall p period hhigh rrise i invalid (hi-impedance) v valid l low z hi-impedance ac characteristics standard operating conditions (unless otherwise stated) operating temperature ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range as described in dc spec section 4.1 . p in v ss c l c l = 50 pf for all pins, except osc2 15 pf for osc2 when external clock is used to drive osc1 21690b.book page 30 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 31 mcp2155 4.3 timing diagrams and specifications figure 4-3: external clock timing table 4-3: external clock timing requirements ac characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range is described in section 4.1 param. no. sym characteristic min typ (1) max units conditions 1t osc external clkin period (2 , 3 ) 90.422 90.422 ? ? 90.422 ? ns ns device operation disable clock for low power oscillator period (2) 90.422 ? 90.422 ns 1a f osc external clkin frequency (2 , 3 ) 11.0592 ? 11.0592 mhz oscillator frequency (2) 11.0592 ? 11.0592 mhz 1b f err error in frequency ? ? 0.01 % 1c e clk external clock error ? ? 0.01 % 4tosr, to s f clock in (osc1) rise or fall time ? ? 15 ns note 1: data in the typical (?typ?) column is at 5v, 25 ? c unless otherwise stated. these parameters are for design guidance only and are not tested. 2: all specified values are based on oscillator characterization data under standard operating conditions. exceeding these specified limits may result in unstable oscillator operation and/or higher than expected cur- rent consumption. when an external clock input is used, the ?max? cycle time limit is ?dc? (no clock) for all devices. 3: a duty cycle of no more than 60% (high time/low time, or low time/h igh time) is recomm ended for external clock inputs. osc1 q4 q1 q2 q3 q4 q1 133 44 2 21690b.book page 31 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 32 preliminary ? 2001-2013 microchip technology inc. figure 4-4: output waveform table 4-4: output timing requirements ac characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range is described in section 4.1 param. no. sym characteristic min typ (1) max units conditions 20 tor rx and txir pin rise time (2) ?1025ns 21 tof rx and txir pin fall time (2) ?1025ns note 1: data in the typical (?typ?) column is at 5v, 25c unless otherwise stated. 2: see figure 4-2 for loading conditions. osc1 output pin q4 q1 q2 q3 20, 21 old value new value note: refer to figure 4-2 for load conditions. 21690b.book page 32 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 33 mcp2155 figure 4-5: reset and device reset timing table 4-5: reset and device reset requirements ac characteristics standard operating conditions (unless otherwise speci- fied) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range is described in section 4.1 param. no. sym characteristic min typ (1) max units conditions 30 t rst l reset pulse width (low) 2000 ? ? ns v dd = 5.0 v 32 t ost oscillator start-up timer period 1024 ? 1024 t osc 33 t pwrt power up timer period 28 72 132 ms v dd = 5.0 v 34 t ioz output hi-impedance from reset low or device reset ??2 s note 1: data in the typical (?typ?) column is at 5v, 25 ? c, unless otherwise stated. v dd reset reset detected pwrt timeout osc timeout internal reset 33 32 30 34 output pin 34 21690b.book page 33 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 34 preliminary ? 2001-2013 microchip technology inc. figure 4-6: uart asynchronous transmission waveform table 4-6: uart asynchronous transmission requirements ac characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range is described in section 4.1 param. no. sym characteristic min typ max units conditions ir100 t txbit transmit baud rate 1152 ? 1152 t osc baud2:baud0 = 00 576 ? 576 t osc baud2:baud0 = 01 192 ? 192 t osc baud2:baud0 = 10 96 ? 96 t osc baud2:baud0 = 11 ir101 e txbit transmit (tx pin) baud rate error (into mcp2155) ?? 2% ir102 e txirbit transmit (txir pin) baud rate error (out of mcp2155 ) (1) ?? 1% ir103 t tx rf tx pin rise time and fall time ? ? 25 ns note 1: this error is not additive to ir101 parameter. note: refer to figure 4-2 for load conditions. ir103 tx pin ir100 ir103 ir100 ir100 ir100 start bit data bit data bit data bit 21690b.book page 34 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 35 mcp2155 figure 4-7: uart asynchronous receive timing table 4-7: uart asynchronous receive requirements ac characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range is described in section 4.1 param. no. sym characteristic min typ max units conditions ir110 t rxbit receive baud rate 1152 ? 1152 t osc baud2:baud0 = 00 576 ? 576 t osc baud2:baud0 = 01 192 ? 192 t osc baud2:baud0 = 10 96 ? 96 t osc baud2:baud0 = 11 ir111 e rxbit receive (rxir pin) baud rate error (into mcp2155) ?? 1% ir112 e rxbit receive (rx pin) baud rate error (out of mcp2155) (1) ?? 1% ir113 t tx rf rx pin rise time and fall time ? ? 25 ns note 1: this error is not additive to ir111 parameter. note: refer to figure 4-2 for load conditions. ir113 rx pin ir113 ir110 ir110 ir110 start bit data bit data bit data bit ir110 21690b.book page 35 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 36 preliminary ? 2001-2013 microchip technology inc. figure 4-8: txir waveforms table 4-8: txir requirements ac characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range is described in section 4.1 param. no. sym characteristic min typ max units conditions ir100a t txirbit transmit baud rate 1152 ? 1152 t osc baud = 9600 576 ? 576 t osc baud = 19200 288 ? 288 t osc baud = 38400 192 ? 192 t osc baud = 57600 96 ? 96 t osc baud = 115200 ir121 t txir pw txir pulse width 24 ? 24 t osc ir122 t txir p txir bit period (1) ?16?t bitclk note 1: t bitclk = t txbit /16. bitclk txir 0100 0 1 ir100a ir121 start bit data bit 7 data bit 6 data bit 5 data bit ... ir122 ir122 ir122 ir122 ir122 ir122 21690b.book page 36 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 37 mcp2155 figure 4-9: rxir waveforms table 4-9: rxir requirements ac characteristics standard operating conditions (unless otherwise specified) operating temperature: ?40 ? c ? t a ? +85 ? c (industrial) operating voltage v dd range is described in section 4.1 param. no. sym characteristic min typ max units conditions ir110a t rxirbit receive baud rate 1152 ? 1152 t osc baud = 9600 576 ? 576 t osc baud = 19200 288 ? 288 t osc baud = 38400 192 ? 192 t osc baud = 57600 96 ? 96 t osc baud = 115200 ir131a t rxir pw rxir pulse width 2 ? 24 t osc ir132 t rxir p rxir bit period (1) ?16?t bitclk note 1: t bitclk = t rxbit /16. bitclk rxir 0100 0 1 ir131a ir110a ir131b ir131b ir131b ir131b ir131b ir131b start bit data bit 7 data bit 6 data bit 5 data bit ... start bit data bit 7 data bit 6 data bit 5 data bit ... 21690b.book page 37 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 38 preliminary ? 2001-2013 microchip technology inc. notes: 21690b.book page 38 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 39 mcp2155 5.0 dc and ac characteristics graphs and tables not available at this time. 21690b.book page 39 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 40 preliminary ? 2001-2013 microchip technology inc. notes: 21690b.book page 40 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 41 mcp2155 6.0 packaging information 6.1 package marking information 18-lead pdip (300 mil) example: 18-lead soic (300 mil) example: 20-lead ssop (209 mil, 5.30 mm) example: xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxx xxxxx yywwnnn xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxx xxxxx yywwnnn xxxxxxxxxxx xxxxxxxxxxx xxx yywwnnn mcp2155i/ss xxxxxxxxxxx xxx yywwnnn mcp2155-i/so xxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxx xxxxx yywwnnn mcp2155-i/p xxxxxxxxxxxxxxxxx xxxxx yywwnnn legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 21690b.book page 41 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 42 preliminary ? 2001-2013 microchip technology inc. 18-lead plastic dual in-line (p) ? 300 mil (pdip) 15 10 5 15 10 5 ? mold draft angle bottom 15 10 5 15 10 5 ? mold draft angle top 10.92 9.40 7.87 .430 .370 .310 eb overall row spacing 0.56 0.46 0.36 .022 .018 .014 b lower lead width 1.78 1.46 1.14 .070 .058 .045 b1 upper lead width 0.38 0.29 0.20 .015 .012 .008 c lead thickness 3.43 3.30 3.18 .135 .130 .125 l tip to seating plane 22.99 22.80 22.61 .905 .898 .890 d overall length 6.60 6.35 6.10 .260 .250 .240 e1 molded package width 8.26 7.94 7.62 .325 .313 .300 e shoulder to shoulder width 0.38 .015 a1 base to seating plane 3.68 3.30 2.92 .145 .130 .115 a2 molded package thickness 4.32 3.94 3.56 .170 .155 .140 a top to seating plane 2.54 .100 p pitch 18 18 n number of pins max nom min max nom min dimension limits millimeters inches* units 1 2 d n e1 c eb ? e ? p a2 l b1 b a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-001 drawing no. c04-007 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging 21690b.book page 42 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 43 mcp2155 18-lead plastic small outline (so) ? wide, 300 mil (soic) foot angle ? 048048 15 12 0 15 12 0 ? mold draft angle bottom 15 12 0 15 12 0 ? mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.30 0.27 0.23 .012 .011 .009 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.74 0.50 0.25 .029 .020 .010 h chamfer distance 11.73 11.53 11.33 .462 .454 .446 d overall length 7.59 7.49 7.39 .299 .295 .291 e1 molded package width 10.67 10.34 10.01 .420 .407 .394 e overall width 0.30 0.20 0.10 .012 .008 .004 a1 standoff 2.39 2.31 2.24 .094 .091 .088 a2 molded package thickness 2.64 2.50 2.36 .104 .099 .093 a overall height 1.27 .050 p pitch 18 18 n number of pins max nom min max nom min dimension limits millimeters inches* units l ? c ? h 45 ? 1 2 d p n b e1 e ? a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: ms-013 drawing no. c04-051 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging 21690b.book page 43 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 44 preliminary ? 2001-2013 microchip technology inc. 20-lead plastic shrink small outline (ss) ? 209 mil, 5.30 mm (ssop) 10 5 0 10 5 0 ? mold draft angle bottom 10 5 0 10 5 0 ? mold draft angle top 0.38 0.32 0.25 .015 .013 .010 b lead width 203.20 101.60 0.00 8 4 0 ? foot angle 0.25 0.18 0.10 .010 .007 .004 c lead thickness 0.94 0.75 0.56 .037 .030 .022 l foot length 7.34 7.20 7.06 .289 .284 .278 d overall length 5.38 5.25 5.11 .212 .207 .201 e1 molded package width 8.18 7.85 7.59 .322 .309 .299 e overall width 0.25 0.15 0.05 .010 .006 .002 a1 standoff 1.83 1.73 1.63 .072 .068 .064 a2 molded package thickness 1.98 1.85 1.73 .078 .073 .068 a overall height 0.65 .026 p pitch 20 20 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d p n b e e1 l c ? ? ? a2 a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed .010? (0.254mm) per side. jedec equivalent: mo-150 drawing no. c04-072 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging 21690b.book page 44 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 45 mcp2155 appendix a: revision history revision a this is a new data sheet revision k (january 2013) added a note to each package outline drawing. 21690b.book page 45 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 46 preliminary ? 2001-2013 microchip technology inc. notes: 21690b.book page 46 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. ds21690b-page 47 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support 21690b.book page 47 thursday, january 10, 2013 1:06 pm
ds21690b-page 48 ? 2001-2013 microchip technology inc. reader response it is our intention to provide you with the best documentation possible to ensure successful use of your microchip product. if you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please fax your comments to the technical publications manager at (480) 792-4150. please list the following information, and use this outline to provide us with your comments about this document. to: technical publications manager re: reader response total pages sent ________ from: name company address city / state / zip / country telephone: (_______) _________ - _________ application (optional): would you like a reply? y n device: literature number: questions: fax: (______) _________ - _________ ds21690b 1. what are the best features of this document? 2. how does this document meet your hardware and software development needs? 3. do you find the organization of this document easy to follow? if not, why? 4. what additions to the document do you think would enhance the structure and subject? 5. what deletions from the document could be made without affecting the overall usefulness? 6. is there any incorrect or misleading information (what and where)? 7. how would you improve this document? 21690b.book page 48 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 49 mcp2155 product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . sales and support data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recom- mended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products. part no. x /xx package temperature range device device: mcp2155: infrared communications controller mcp2155t: infrared communications controller (tape and reel) temperature range: i = -40c to +85c package: p = plastic dip (300 mil, body), 18-lead so = plastic soic (300 mil, body), 18-lead ss = plastic ssop (209 mil, body), 20-lead examples: a) mcp2155-i/p = industrial temp., pdip packaging b) mcp2155-i/so = industrial temp., soic package c) mcp2155t-i/ss = tape and reel, industrial temp., ssop package 21690b.book page 49 thursday, january 10, 2013 1:06 pm
mcp2155 ds21690b-page 50 preliminary ? 2001-2013 microchip technology inc. notes: 21690b.book page 50 thursday, january 10, 2013 1:06 pm
? 2001-2013 microchip technology inc. preliminary ds21690b-page 51 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, application maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2001-2013, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620768914 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification contained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specifications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management system certified by dnv == iso/ts 16949 == 21690b.book page 51 thursday, january 10, 2013 1:06 pm
ds21690b-page 52 preliminary ? 2001-2013 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/29/12 21690b.book page 52 thursday, january 10, 2013 1:06 pm

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